TSMC’s first generation of 3nm still uses the mature FinFET transistor structure that has been in existence for 20 years. Initial reports claim that this process will commence mass production in the ...

A new chip manufacturing process from Intel Corp. failed to meet Broadcom Inc.’s expectations in a recent evaluation, Reuters reported today. The development may mark a setback for Intel’s foundry ...

Intel has a lot riding on “18A,” its next-generation manufacturing process for silicon chips that the company claims will help it catch up to the lead that competitors like TSMC have built up over the ...

In mid-2003, Intel is expected to begin shipments of Prescott, Intel's first processor in 90nm (0.09-micron) process technology. Prescott and the 90nm process are key elements of Intel's plan to bring ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

The final process node in Intel's foundry roadmap is now ready for production. Intel 18A should propel Intel close to TSMC in terms of performance and efficiency. Ramping up volumes will take time, so ...

In smart manufacturing, timely and accurate data flow is critical. Manufacturers seek to monitor every step in their process to ensure optimal results. However, significant challenges include ...