During the event, SK hynix showed off some of its AI memory products, including its new HBM3E 12-Hi stack memory which it started mass-producing in September, marking a significant milestone in the ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...

Samsung has introduced its "industry-first" HBM3E 12H DRAM, a 12-stack memory with 36GB capacity and 1,280 gigabytes per second bandwidth. Mass production begins in the first half of this year.

JEDEC is still finalizing the HBM4 memory specifications, with Rambus teasing its next-gen HBM4 memory controller that will be prepared for next-gen AI and data center markets, continuing to expand ...

High bandwidth memory (HBM) chips have become a game changer in artificial intelligence (AI) applications by efficiently handling complex algorithms with high memory requirements. They became a major ...

The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum) recently wrapped up in Shenzhen. Themed "AI Applications, Innovation Empowered, "GMIF2025 represented as a gathering of leading ...