The chiplets design combines IP access, interposer expertise, and relationships with HBM suppliers, foundries and OSATs ...
Abstract: In this study, we present the design, fabrication, and measurements of a 3-D heterogeneous integrated RF-module at W-band. A 3-D transition structure based on micro-bumps is fabricated and ...
Abstract: In this article, a large-scale electromagnetic-thermal-mechanical co-simulation solver is implemented, to simulate complex radio frequency components by using a high performance computing ...
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